TSL238T
HIGH-SENSITIVITY
LIGHT-TO-FREQUENCY CONVERTER
TAOS080G  DECEMBER 2007
10
r
r
Copyright E 2007, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MANUFACTURING INFORMATION
The reflow profile specified here describes expected maximum heat exposure of devices during the solder
reflow process of the device on a PWB. Temperature is measured at the top of the device. Devices should be
limited to one pass through the solder reflow profile.
Table 1. TSL238T Solder Reflow Profile
PARAMETER
REFERENCE
TSL238T
Average temperature gradient in preheating
2.5癈/sec
Soak time
t
soak
2 to 3 minutes
Time above T
1
, 217癈
t
1
Max 60 sec
Time above T
2
, 230癈
t
2
Max 50 sec
Time above T
3
, (T
peak
 10?/SPAN>C)
t
3
Max 10 sec
Peak temperature in reflow
T
peak
260?C (0癈/+5癈)
Temperature gradient in cooling
Max 5癈/sec
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale  for reference only
Time (sec)
Figure 13. TSL238T Solder Reflow Profile
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